Copper ≥99.9% (metals basis), spherical powder APS 10 µm

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Copper ≥99.9% (metals basis), spherical powder APS 10 µm
Copper
Formula: Cu
MW: 63,55 g/mol
Boiling Pt: 2595 °C (1013 hPa)
Melting Pt: 1083 °C
Density: 8,94 g/cm³ (20 °C)
Storage Temperature: Ambient
MDL Number: MFCD00010965
CAS Number: 7440-50-8
EINECS: 231-159-6
ADR: 4.1,III
Merck Index: 13,02545

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