Buffered oxide etch (6:1) VLSI for microelectronic use, with surfactant, J.T.Baker®
|
Danger
|
5569-03EA
0
INR
5569-03
Buffered oxide etch (6:1) VLSI for microelectronic use, with surfactant, J.T.Baker®
Buffered oxide etch
UN:
2922 ADR: 8,II |
Specification Test Results
For Microelectronic Use | |
Ship and store material above 60°F (16°C) | |
Ammonium Fluoride (NH₄F)(w/w) | 33.5 - 35.5 % |
Hydrofluoric Acid (HF)(w/w) | 7.0 - 7.3 % |
Residue after Ignition | ≤10 ppm |
Trace Impurities - Aluminum (Al) | ≤200.0 ppb |
Arsenic and Antimony (as As) | ≤30.0 ppb |
Trace Impurities - Barium (Ba) | ≤1000.0 ppb |
Trace Impurities - Boron (B) | ≤200.0 ppb |
Trace Impurities - Cadmium (Cd) | ≤500.0 ppb |
Trace Impurities - Calcium (Ca) | ≤200.0 ppb |
Trace Impurities - Chromium (Cr) | ≤100.0 ppb |
Trace Impurities - Cobalt (Co) | ≤500.0 ppb |
Trace Impurities - Copper (Cu) | ≤100.0 ppb |
Trace Impurities - Gallium (Ga) | ≤500.0 ppb |
Trace Impurities - Germanium (Ge) | ≤500.0 ppb |
Trace Impurities - Gold (Au) | ≤300.0 ppb |
Heavy Metals (as Pb) | ≤1000.0 ppb |
Trace Impurities - Iron (Fe) | ≤200.0 ppb |
Trace Impurities - Lead (Pb) | ≤300.0 ppb |
Trace Impurities - Lithium (Li) | ≤1000.0 ppb |
Trace Impurities - Magnesium (Mg) | ≤200.0 ppb |
Trace Impurities - Manganese (Mn) | ≤200.0 ppb |
Trace Impurities - Nickel (Ni) | ≤200.0 ppb |
Trace Impurities - Potassium (K) | ≤300.0 ppb |
Trace Impurities - Silver (Ag) | ≤500.0 ppb |
Trace Impurities - Sodium (Na) | ≤300 ppb |
Trace Impurities - Strontium (Sr) | ≤1000.0 ppb |
Trace Impurities - Tin (Sn) | ≤300.0 ppb |
Trace Impurities - Titanium (Ti) | ≤300.0 ppb |
Trace Impurities - Zinc (Zn) | ≤300.0 ppb |
Particle Count - 1.0 µm and greater | ≤25 par/ml |
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